Hybrid Integrated Circuits
Product Details:
| Certification | TS16949 |
|---|---|
| Place of Origin | Republic of Korea |
| Model Number | Hybrid Integrated Circuits |
Payment & Shipping Terms:
| Payment Terms: | T/T |
|---|
Detailed Product Description
Hybrid microelectronics is a packaging and interconnection technology for combining two or more semiconductor devices on a common interconnect substrate, typically to create a specific electrical function.
Material - base substrate: Al2o3 - conductor: Au, ag, pdag, cu - dielectrics: Glass-ceramics, glasses - resistor: Ruo2 dopped glasses spec - according to customer's spec.
Hybrid Integrated Circuits
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Company Info
WINIX CO LTD
[South Korea]
[Verified Member]
City: Gumi-si
Province/State: Gyeongsangbuk-do
Country/Region : South Korea
Business Type:Manufacturer
Online Postings: Products
